3DPIXA: Options and Challenges with Wirebond Inspection

Wednesday, 18. October 2017

Inspecting wire bonding processes inline is currently one of the most challenging tasks in machine vision. Traditional inspection is performed on 2D images, color or grayscale, and consists for instance of wire tracing, Bent and broken wire detection, Wire solder spot / wedge analysis, Wire attendance check. 2D inspection is insufficient for some tasks and 3D information is required. Chromasens 3DPIXA provides such information in form of a “height” (disparity) image, in addition to the conventional color or grayscale image.