White Paper

11.01.2019

Application specific color calibration with truePIXA

The aim of this work is to illustrate the dependence of measurement performance of multi-spectral imaging systems on the type of color calibration used. For application-specific color calibration, high performance can be achieved. If a non-adequate color calibration is used, the measurement performance might drop considerably. These effects are demonstrated empirically by means of textile and paper measurement applications. The underlying theory for the measurement performance drop is explained briefly. 

11.01.2019

Inspection of bulk material with allPIXA wave and prism camera

The aim of this work is to compare the trilinear line-scan camera allPIXA wave with a prism based camera with respect to bulk material inspection. Traditionally, prism-based cameras are often selected over trilinear cameras when it comes to bulk material scanning, as the inherent line-shift of a trilinear camera can only be corrected for when the object scan velocity is known. We demonstrate that this traditional approach is not always necessary if the right trilinear sensor is selected and operated in binning mode to average multiple pixels.

06.12.2017

3DPIXA: Coaxial Brightfield Illumination for 3DPIXA Applications

Choosing the right illumination for the application is critical for acquiring the high quality images needed for calculating 3D data. We compare the imaging results of a directional coaxial brightfield illumination with a Corona tube light in terms of color image quality and height map for different samples. It could be shown that for material that exhibit considerable amounts of subsurface scattering, coaxial lighting geometry benefits the 3D measurement using 3DPIXA.

 

18.10.2017

3DPIXA: Options and Challenges with Wirebond Inspection

Inspecting wire bonding processes inline is currently one of the most challenging tasks in machine vision. Traditional inspection is performed on 2D images, color or grayscale, and consists for instance of wire tracing, Bent and broken wire detection, Wire solder spot / wedge analysis, Wire attendance check. 2D inspection is insufficient for some tasks and 3D information is required.

07.08.2017

3DPIXA: Repeatability Measurements

The procedure for measuring camera repeatability is described and illustrated by example of a 15µm 3DPIXA camera module. It is elaborated how to distinguish repeatability of the camera, and repeatability of the entire scanning system. Practical information is given regarding how to analyze scan data and how to account for measurement bias.

08.03.2016

Optimal lighting for line scan camera applications

The light factor is often neglected when discussing high performance image processing systems. Every brilliant image requires two things: an excellent camera and excellent lighting. The following article offers good advice for the selection of an optimal lighting solution and important practical tips.