News

10.12.2020

First Chromasens SWIR camera

The allPIXA SWIR is the first short-wave infrared (SWIR) line scan camera in Chromasens' allPIXA family.

30.10.2020

3DPIXA wave for BGA inspection

In the electronics and semiconductor industry soldering connections using BGAs (Ball Grid Arrays) are widespread. Most prominent examples are the mounting of microprocessors.The only way to ensure this is a one hundred percent inspection, where each solder ball must be measured three-dimensionally.

28.07.2020

Updated product brochure

Read the complete brochure in English here & in Mandarin here

03.06.2020

Technical Note - Semiconductor wafer inspection using allPIXA wave

Capturing yield limiting defects is crucial for semiconductor wafer devices yield. Here we describe how semiconductor wafer manufacturing can take advantage of its ultra-high resolution 15,360 pixels and rich features to advantage of in-line inspection systems allPIXA wave Trilinear color and mono TDI line scan camera.

25.05.2020

Whitepaper - Synchronizing modes of allPIXA classic, pro and wave

The white paper gives a general overview as well as to function as a reference for all tasks related to synchronizing allPIXA classic, allPIXA pro and allPIXA wave cameras.

07.05.2020

Connector pin inspection

This report is an example how to use a 3DPixa and the 3DAPI to implement a measuring task for connectors.

23.03.2020

COVID-19 Statement

A statement by Peter Tix about measures taken by Chromasens to secure deliveries during the COVID-19 crisis.

20.01.2020

New Technical Note

This technical note is about an alternative 3D reconstruction method.

09.01.2020

New White Paper

This white paper gives a comprehensive overview on the limitations of the block-matching approach in height reconstruction for passive stereoscopy. It describes a variety of different artefacts that appear at certain image features.

15.11.2019

New customer story

Line-based stereo vision system checks ball and roller bearings. Read the whole case study here.