3DPIXA HR 5 µm and 3DPIXA HR 2 µm stand out thanks to improved image quality based on optimized optics. More robust and precise 3D data are achieved.
“Already the names of our new cameras clearly define the user benefit of ‘High resolution (HR)’. Operators can now inspect even smaller structures and objects in the micrometer range.” Klaus Riemer, 3D product manager at Chromasens explains.
3DPIXA HR 5 µm has a large field of view of approx. 35 mm and a scanning speed of up to 30 kHz, which allows for very short inspection times at a resolution of 5 µm.
3DPIXA HR 2 µm is designed for applications requiring even higher resolution and precision and covers a 16 mm field of view.
These features are generally used in electronics, semiconductor technology and in the automotive sector. By way of an example, Klaus Riemer mentions that “with ‚Flip-Chip-Assembly’, miniaturized components are no longer soldered, they are pressed. In order to do this, they must be correctly aligned in the µm-range, requiring inspection systems with a very high optical resolution”.
Optical design of the new 3D cameras was adapted to the required high resolution. The interaction between camera electronics and optics was also improved, resulting in greater image sharpness (focus) at the edges.
Like other Chromasens 3D-cameras, 3DPIXA HR 5 µm and 3DPIXA HR 2 µm are the result of a unique combination of line scan technology and stereometry. Thanks to advanced algorithms and high GPU performance, 3D measurements are achieved at a speed and precision unequalled to date.
Both 3D-line scan cameras support machine vision libraries like HALCON (MVTec), MIL (Matrox), LabVIEW (National Instruments) and Coake (SAC).
3DPIXA HR 5 µm will be available by the end of 2016, 3DPIXA HR 2 µm by mid 2017.