BGA Inspection

Application Challenges

  • High precision measurement of 3D shape and height of each single BGA
  • Substrate surface contamination and defect detection
  • 100%  Inline inspection
  • Fastest speed, high production throughput

 

3D Solution

  • 3DPIXA dual
  • Combined illumination: diffuse tube light + bright field + dark field​
  • GPU accelerated high speed 3D data reconstruction
  • High precision​ measurement
  • Scalable large FOV from 35 to 150mm
  • High dynamic range​
  • BGA height and shape measurement
  • Bright field + dark field illumination based substrate surface inspection
  • Little occlusion compared to laser triangulation
Camera Res/Pixel FOV Max. Speed Illumination Controller Others (SW, accessories)

3DPIXA dual HR 5µm
CP000520-D02-005-0035

5 µm

35 mm

148 mm/s

Tube Light

CP000200-170T-04-2.5BNL 
or
Combined Illumination

CP000606...

XLC4-1A

LED Controller

CP000411-1A

CS 3D API / Dongle

3DPIXA wave compact 8µm
CP000470-C01-008-0036

8 µm

36 mm

147 mm/s

3DPIXA wave dual 10µm
CP000600-D02-010-0150

10 µm

150 mm

184 mm/s